RFID tag maker Texas Instruments and Smurfit-Stone Container Corp (a Chicago-based manufacturer of cardboard and packaging products) have jointly developed a packaging model for "RFID packaging integrated tags" that uses RFID tags on packaging boxes. . This model integrates an RFID tag inlay directly into the corrugated cardboard box. The tag antenna is printed directly onto the box with conductive ink. The antenna is sealed with an RFID tag with a conductive strap. Corrugated cardboard box is divided into three layers: an inner wall layer (noodle board), middle wave layer and outer wall layer (noodle board). The tag inlay embedded between the inner wall layer and the corrugated layer is well protected.
Using this method, the process of placing the antenna on the IC chip does not need to be carried out in a clean space. It is for this reason that some label packagers are interested in such a label band of TI. The company predicts that this type of integration of RFID tag inlays into packaging materials will save labor costs and material costs for consumer packaging companies in the future, as this model does not require the purchase of separate package tags.
Source: RFID World Network
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