The cost of this type of adhesive is the cause of the current limited use of structural adhesives. Epoxy-phenolic adhesives are mainly used for military purposes with operating temperatures of 149-260°C. The epoxy-phenolic adhesive is a mixture of a thermosetting phenolic resin and an epoxy resin, and is supplied in the form of a viscous liquid containing a solution, or a film or tape in which a glass cloth or fabric is used as a carrier.
The solvent mixture is usually heated and dried at 80-90[deg.] C. for 20 minutes before the adherend is assembled. It is generally cured at 95° C. for 30 minutes under contact pressure and then cured at a temperature of about 165° C. and pressure of 0.07-0.4 MPa for 30 minutes to 2 hours. Post-curing is used to obtain the best performance at high temperatures.
Epoxy-phenolic adhesives are used for bonding high-temperature structures of metals (including copper and its alloys, titanium, galvanized iron and magnesium), glass, ceramics and phenolic composites; also used for bonding honeycomb sandwich composite structures. Liquid adhesives are often used as tape primers. Epoxy-phenolic adhesives have high shear strength and tensile strength over a wide range of temperatures. The adhesive film has higher strength than glue, but the peeling and impact strength are relatively low.
For the strength of epoxy-phenolic films and tape adhesives, see the section on film and tape adhesives below. Films and tapes have good weatherability, aging resistance, water resistance, weak acid resistance, aromatic oil resistance, ethylene glycol resistance, and aliphatic solvent properties. The use temperature is usually -60-200 °C, while the special formula can be applied to -260 °C low temperature.
The solvent mixture is usually heated and dried at 80-90[deg.] C. for 20 minutes before the adherend is assembled. It is generally cured at 95° C. for 30 minutes under contact pressure and then cured at a temperature of about 165° C. and pressure of 0.07-0.4 MPa for 30 minutes to 2 hours. Post-curing is used to obtain the best performance at high temperatures.
Epoxy-phenolic adhesives are used for bonding high-temperature structures of metals (including copper and its alloys, titanium, galvanized iron and magnesium), glass, ceramics and phenolic composites; also used for bonding honeycomb sandwich composite structures. Liquid adhesives are often used as tape primers. Epoxy-phenolic adhesives have high shear strength and tensile strength over a wide range of temperatures. The adhesive film has higher strength than glue, but the peeling and impact strength are relatively low.
For the strength of epoxy-phenolic films and tape adhesives, see the section on film and tape adhesives below. Films and tapes have good weatherability, aging resistance, water resistance, weak acid resistance, aromatic oil resistance, ethylene glycol resistance, and aliphatic solvent properties. The use temperature is usually -60-200 °C, while the special formula can be applied to -260 °C low temperature.
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