DEK Introduces New Stencil Solutions for Ultra Fine Print

DEK announced the launch of its new VectorGuard Platinum stencil technology. New technologies available to customers in DEK's Asia, Europe and the Americas provide semiconductor manufacturers with the ideal solution for the next generation of challenges.

The micro-designed VectorGuard Platinum can handle the challenges of fine-printing and is the ideal stencil solution for advanced applications such as wafer-level packaging, direct chip placement, flip chip and ball grid array (BGA) applications. Capable of providing aperture accuracy of less than 3μm and positioning tolerances of less than 50μm and less than 20μm, VectorGuard Platinum's novel screen manufacturing process ensures optimal process efficiency by achieving high-accuracy solder paste transfer and consistent solder paste volume repeatability.

The launch of DEK's new product represents the company's Platinum customers who have been able to benefit from the patented frameless VectorGuard Stencil System. Designed for printing process optimization and first-pass pass rates, lightweight and compact technology provides simple, automatic tensioning that goes beyond traditional pneumatic assisted processes. Offering enhanced positioning accuracy, stencil life, ease of storage, improved rigidity, safer operation, and breakthrough ease-of-use, VectorGuard systems include VectorGuard Silver with optimized lead-free printing and VectorGuard with cost-effective adhesive deposition. PumpPrint's wide selection of different foil technologies extends the manufacturing flexibility.